Partial Silicon Wafer Sale! Buy as few as One Wafer!

This page organizes our silicon wafer inventory by diameter (12"/300mm, 8"/200mm, 6"/150mm, 5", 4", 3", 2", 1", and <1"). Use the table to compare doping type, crystal orientation, thickness, surface finish, and resistivity so you can quickly match a wafer to your process (MEMS, photonics, thin films, etching, bonding, or device prototyping).

UW Logo

See below for our Partial Silicon Wafer Cassettes.

Email us with what you can use or send us your own specs and quantity to quote you!

Get Your Quote FAST! Or, Buy Online and Start Researching Today!





Related Silicon Wafer Sizes, Types, and Specifications

 

Partial Silicon (Si) Wafer Cassettes

See below for our partial cassettes of 150mm, 100mm, 76.2mm, 50.7mm, 25.3mm, CZ and FZ, SSP and DSP ready to ship!

12" Wafers,  8" Wafers,  6" Wafers,  5" Wafers,  4" Wafers,  3" Wafers,  2" Wafers,  1" Wafers,  <1" Wafers
Note: Surface - P = Polished, E = Etched, C = AsCut, G = Ground, Ox = Oxide (on that surface); Material - CZ unless noted
Item Qty in Stock Price ($/wafer) Material Orient. Diam. Thck (µm) Surf. Resistivity (Ωcm) Comment
8" Wafers
12123 12 50.40 n-type Si:P [100] 8" 890 ±15 C/C 5–35 {25–30} SEMI notch, Empak cst
6" Wafers
K667 2 180.00 p-type Si:B [100] 6" 900 C/C FZ 2,700–3,300 SEMI, 1Flat (57.5mm), Empak cst
A823 7 144.00 p-type Si:B [100] 6" 625 P/P FZ 600–900 SEMI TEST (haze on edges)
B210621,256.40p-type Si:B[100]6"772 ±1P/PFZ 50-150JEIDA Prime, 1Flat, TTV<1µm, Bow<3.5µm, Warp<8µm, TIR<1µm, Empak cst
A21813450.00p-type Si:B[100] ±0.05°6"650P/PFZ 1-30SEMI Prime, 1Flat (57.5mm), tight Surface & Flat Orientation tolerance, MCC Lifetime>1,000µs, Empak cst
B2081450.00n-type Si:P[100] ±1°6"1,000 ±50P/PFZ >9,500SEMI Prime, 1Flat (57.5mm), MCC Lifetime>6,000µs, Empak cst
E2391135.00n-type Si:P[100]6"825C/CFZ 7,000-8,000 {7,025-7,856}SEMI, 1Flat, MCC Lifetime=7,562µs, in Unsealed Empak cst
F7005161.64n-type Si:P[100-6° towards[111]] ±0.5°6"790 ±10C/CFZ >3,500SEMI, 1Flat (57.5mm), Empak cst
498214122.40n-type Si:P[100-6° towards[111]] ±0.5°6"675P/PFZ >1,000SEMI Prime, Notch on <010> {not on <011>}, Front-side LaserMark, Empak cst
D9821180.00n-type Si:P[100-6° towards[111]] ±0.5°6"675BROKENFZ >1,000SEMI notch BROKEN - one piece ~50% of wafer, other pieces ~20% of wafer, Empak cst
A13982260.28n-type Si:P[100]6"350 ±10P/PFZ 50-70SEMI Prime, 1Flat (57.5mm), TTV<5µm, MCC Lifetime>10,000µs, Empak cst
B06693195.48n-type Si:P[100]6"500 ±10P/PFZ 50-70SEMI Prime, 1Flat, MCC Lifetime>1,000µs, Empak cst
53252212.40n-type Si:P[100]6"725P/PFZ 50-70 {57-62}SEMI Prime, 1Flat (57.5mm), MCC Lifetime=15,700µs, Empak cst
G8836176.40n-type Si:P[100]6"650 ±5P/PFZ 40-90SEMI Prime, 1Flat (57.5mm), TTV<3µm, Empak cst
F8838176.40n-type Si:P[100]6"675 ±5P/PFZ 40-90SEMI Prime, 1Flat (57.5mm), TTV<3µm, Empak cst
1251912266.76n-type Si:P[100]6"380 ±10P/PFZ 20-70SEMI Prime, 1Flat, TTV<5µm, Empak cst
A232410242.28n-type Si:P[100]6"500 ±10P/PFZ 20-70SEMI Prime, 1Flat, Front-Side LaserMark, MCC Lifetime>1,000µs, TTV<5µm, Empak cst
1150710221.04n-type Si:P[100]6"280P/PFZ 3-4 {3.0-3.3}Prime, 2Flats, PV FZ, MCC Lifetime=21,294µs, Empak cst
G228390.00n-type Si:P[111] ±0.5°6"300 ±15BROKENFZ >6,000BROKEN into a dozen large pieces ranging from 65% of wafer to 5% (plus small pieces)
N4457270.00n-type Si:P[112-5.0° towards[11-1]] ±0.5°6"875 ±10E/EFZ >3,000SEMI, 1Flat (47.5mm), TTV<4µm, Surface Chips, Empak cst
D9293180.00Intrinsic Si:-[100]6"675P/EFZ >20,000SEMI TEST (scratched), 1Flat (57.5mm), MCC Lifetime>1,000µs, Unsealed Empak cst
A097411,800.00Intrinsic Si:-[100]6"3,250 ±100C/CFZ >20,000SEMI, NO Flats, MCC Lifetime>1,000µs, No Edge Rounding (minor edge-chips), Individual cst
A09545162.00p-type Si:B[17,10,10]6"700P/P>0.1SEMI Prime Notch, Empak cst
G4585180.00p-type Si:B[110] ±0.5°6"390 ±10C/C>10SEMI, 1Flat (57.5mm) at <111>±0.5°, Empak cst
A03344135.00p-type Si:B[110] ±0.25°6"625 ±15P/E10--20SEMI Prime, 2Flats {PF at <111>±0.5°, SF at <111> CW 109.5° from PF}, TTV<5µm, Empak cst
D2831180.00p-type Si:B[110] ±0.5°6"675P/P>10SEMI Prime, 2Flats {PF(57mm) at <111>±1°, SF(37mm) at <111> CW 70.5° from PF}, Empak cst
A19262180.00p-type Si:B[100]6"675 ±5P/P10--20SEMI Prime, 1Flat (57.5mm), TTV<1µm, with front side LaserMark, Empak cst
1199251,029.60p-type Si:B[100]6"6,350P/E5--10Prime, NO Flats, Sealed in a multi-wafer box of 5 wafers
A19251356.40p-type Si:B[100-9.74°] ±0.1°6"275P/P1--35SEMI Prime, 1Flat (57.5mm), with Back-side LaserMark, Empak cst
C4621144.00p-type Si:B[100]6"440P/E1--35SEMI Prime, 1Flat (57.5mm), Empak cst
R3921180.00p-type Si:B[100]6"620P/P1--35SEMI Prime, 1Flat (57.5mm), TTV<1µm, Empak cst
82131344.28p-type Si:B[100]6"625 ±15P/E1-100SEMI Prime, 2Flats, Particle Count <20@0.2µm, Empak cst
A14282135.00p-type Si:B[100]6"675P/P1--5SEMI Prime, 1Flat (57.5mm), Empak cst
A15013122.40p-type Si:B[100]6"675P/P1--35Prime, NO Flats, Empak cst
S5918936.00p-type Si:B[100]6"225P/P0.01-0.02SEMI TEST - Scratched, 1Flat (57.5mm), Empak cst
A19242179.64p-type Si:B[100]6"275P/P0.01-0.02SEMI Prime, 1Flat (57.5mm), Empak cst
TS104672.00p-type Si:B[100]6"625 ±15P/EOx0.01-0.02 {0.0139-0.0144}SEMI Prime, JEIDA Flat 47.5mm, Back-side LTO (0.3-0.4)µm thick, TTV<6µm, Empak csts of 2 + 4 wafers
G831272.00p-type Si:B[100-6° towards[111]] ±0.5°6"675P/P0.01-0.02SEMI TEST (scratched), 1Flat (57.5mm), in Unsealed Empak cst
A12221213.84p-type Si:B[100]6"1,300P/P0.001-0.005SEMI Prime, 1Flat (57.5mm), Empak cst
E7862162.00p-type Si:B[100]6"1,465C/C0.001-0.005SEMI, 1Flat (57.5mm), Empak cst
J6681431.68p-type Si:B[111] ±0.5°6"675E/E0.010-0.025SEMI, 1Flat (57.5mm), Empak cst
1185612622.80n-type Si:P[100]6"3,093 ±50P/P25-30SEMI Prime, 1Flat (57.5mm), TTV<5µm, Groups of 2 + 10 wafers
A06401230.40n-type Si:P[100]6"1,300P/P15-35SEMI notch Prime, Empak cst
A21043230.40n-type Si:P[100]6"675P/P10--35SEMI Prime Notch, Laser Mark on front side, Empak cst
A02434396.00n-type Si:P[100]6"725P/P5--35SEMI Prime, 1 JEIDA Flat(47.5mm), TTV<0.6µm, Bow<8µm, Warp<18µm, with data on each wafer, identified by LaserMark, in Empak cst
A21081360.00n-type Si:P[100]6"665 ±1P/P1-100 {5-35}JEIDA Prime, 1Flat, TTV<1µm, TIR<1µm, Bow<4µm, Warp<8µm, Empak cst
C7167216.00n-type Si:P[100-28° towards[110]] ±1°6"700P/P1-100SEMI Prime, Notch, TTV<2µm, Empak cst
H2466162.00n-type Si:P[100]6"710 ±15P/P1-100SEMI Prime, Notch, TTV<2µm, Empak cst
F0894270.00n-type Si:P[100]6"1,910 ±10P/P1-100SEMI Prime, 1Flat (57.5mm), TTV<5µm, sealed in stacked trays of 1 & 3 wafer
H6317270.00n-type Si:P[100]6"1,910 ±10P/P1-100SEMI Prime, 1Flat (57.5mm), TTV<3µm, in single wafer cst
123622176.40n-type Si:P[100]6"2,950 ±50P/P1-100SEMI Prime, 1Flat (57.5mm), in Individual csts, Sold in pack of 2 wafers
A24542288.00n-type Si:P[100]6"2,950P/P1--10SEMI Prime, 1Flat (57.5mm), In Group of 2 wafers
A040519.00n-type Si:P[100] ±3°156x156150 ±10C/C0.3-2.1Pseudo-Square (210mm diagonal) PV wafers as cut by wire saw, MCC Lifetime>500µs, packed in coin-roll
X91121018.00n-type Si:As[100]6"E/E0.001-0.005RTP, 1Flat, In Unsealed Empak cst
C3161072.00n-type Si:P[911] ±0.5°6"1,500G/G0.1-35.0SEMI Prime, 1Flat, Empak cst
P4065360.00n-type Si:P[411] ±1°6"1,000P/P1-100SEMI Prime, 1Flat (57.5mm), TTV<5µm, Empak cst
Q4061180.00n-type Si:P[411] ±1°6"1,075 ±50P/P1-100SEMI TEST (Dirty, scratched), 1Flat (57.5mm), Empak cst
B07871538.88n-type Si:P[111-3.5°] ±0.5°6"267 ±10E/E0.212-0.237SEMI, Bright etch (both sides), 1Flat 42.5±2.5mm, at 15±1° CW from <110>, Empak cst
109261061.20n-type Si:Sb[111] ±1.0°6"315 ±15P/E0.005-0.020 {0.010-0.020}Prime, 1Flat {42.5mm long, 15±1° CW from <110>}, Back-side Acid etched, Empak cst
TS109343.20n-type Si:As[111-4°] ±0.5°6"508 ±15P/E0.0023-0.0026SEMI Prime, 1Flat (57.5mm), TTV<8µm, Empak cst (16×25+21+17+16+3×12 wafers)
TS157690.00n-type Si:As[111-4°] ±0.5°6"508 ±15P/E0.0023-0.0026SEMI Prime, 1Flat (57.5mm), TTV<8µm, in Empak cassettes of 2 & 4 wafers
A11014576.00n-type Si:P[522] ±0.5°6"650P/P10--35Prime, 2Flats, Empak cst
A11623324.00p-type Si:B[100]6"600P/PFZ 2,652-2,743SEMI Prime, 1Flat (57.5mm), Empak cst
A06263180.00p-type Si:B[100] ±0.1°6"775P/PFZ >2,500SEMI Prime, 1Flat (57.5mm), TTV<1µm, Empak cst
A100515450.00p-type Si:B[100-10° towards[110]] ±0.5°6"300P/PFZ 800-1,000SEMI Prime, 1Flat, MCC Lifetime>1,000µs, Empak cst
B13261684.00p-type Si:B[100]6"650P/PFZ 100-200SEMI Prime, 1Flat (57.5mm), MCC Lifetime>5,000µs, Empak cst
A11072453.60p-type Si:B[100]6"675P/PFZ 100-200SEMI Prime, 1Flat (57.5mm), MCC Lifetime>5,000µs, Empak cst
S588510125.64p-type Si:B[100] ±1°6"700P/PFZ 80-120SEMI Prime, 1Flat (57.5mm), Empak cst
H50310140.40p-type Si:B[100]6"725P/PFZ >50SEMI Prime, 1Flat, TTV<5µm, MCC Lifetime>1,000µs, Empak cst
A2106101,616.40p-type Si:B[100]6"762 ±12P/PFZ >50JEIDA Prime, 1Flat, TTV<1µm, Bow<4.5µm, Warp<10µm, TIR<1µm, Empak cst
B13432324.00p-type Si:B[100]6"650P/PFZ 8-13SEMI Prime, 1Flat (57.5mm), Empak cst
D2875176.40p-type Si:B[100] ±0.05°6"650P/PFZ 1-30SEMI Prime, 1Flat (57.5mm), MCC Lifetime>1,000µs, Empak cst
E28715176.40p-type Si:B[100] ±0.1°6"650P/PFZ 1-30SEMI Prime, 1Flat (57.5mm), MCC Lifetime>1,000µs, Empak cst
F23120158.40p-type Si:B[100]6"650P/PFZ 1-30 {1.379-1.382}SEMI Prime, 1Flat (57.5mm), MCC Lifetime>1,705µs, Empak cst
O57310450.00p-type Si:B[100] ±0.05°6"650P/PFZ 1-30SEMI Prime, 1Flat (57.5mm), TTV<1µm, Tight Surface & Flat Orientation tolerance, MCC Lifetime>1,000µs, Back-side LaserMark, Empak cst
A020612140.40p-type Si:B[100]6"675P/PFZ 1-30SEMI Prime, 1Flat (57.5mm), with LaserMark, Empak cst
A060010768.96p-type Si:B[100]6"675 ±5P/PFZ 1-30SEMI Prime, 1Flat (57.5mm), TTV<1µm, Empak cst
C2081900.00n-type Si:P[100] ±1°6"950 ±50P/PFZ >9,500SEMI Prime, 1Flat (57.5mm), MCC Lifetime>6,934µs, Empak cst
B21353576.00n-type Si:P[100]6"500 ±5P/PFZ 60-70SEMI Prime, 1Flat, MCC Lifetime>1,000µs, with Back-Side LaserMark, TTV<0.5µm, Empak cst
J3905234.00n-type Si:P[100]6"500 ±10P/PFZ 50-70 {57-62}SEMI Prime, 1Flat (57.5mm), Lifetime=15,799µs, Empak cst
H8835315.36n-type Si:P[100]6"625 ±5P/PFZ 40-90SEMI Prime, 1Flat (57.5mm), TTV<5µm, Empak cst
A13995360.00n-type Si:P[100]6"1,500 ±15P/PFZ 40-90SEMI Prime, 1Flat (57.5mm), MCC Lifetime>2,400µs, TTV<5µm, Empak cst
B22203273.96n-type Si:P[100]6"750 ±10P/PFZ 30-70SEMI Prime, 1Flat, MCC Lifetime>1,000µs, With Front-Side LaserMark, Empak cst
A092110206.28n-type Si:P[100]6"500 ±10P/PFZ 20-70SEMI Prime, 1Flat, Empak cst
A23522206.28n-type Si:P[100]6"500 ±10P/PFZ 20-70SEMI Prime, 1Flat, with Front-Side LaserMark, MCC Lifetime>1,000µs, Empak cst
B232410242.28n-type Si:P[100]6"500 ±10P/PFZ 20-70SEMI Prime, 1Flat, with Front-Side LaserMark, MCC Lifetime>1,000µs, Empak cst
E06410216.00n-type Si:P[111] ±0.5°6"425P/PFZ >3,000SEMI Prime, 2Flats, Empak cst
K34315338.40n-type Si:P[112-5° towards[11-1]] ±0.5°6"800 ±10P/PFZ >3,000SEMI Prime, 1 JEIDA Flat (47.5mm), TTV<4µm, MCC Lifetime>1,000µs, Empak cst
D8175504.00Intrinsic Si:-[100]6"650P/PFZ >65,000SEMI Prime, Notch, Empak cst
A75210395.64Intrinsic Si:-[100] ±0.1°6"720P/PFZ >65,000SEMI Prime, 1Flat (57.5mm), Empak cst
A196231,130.40Intrinsic Si:-[100-9.7°] ±0.5°6"500 ±5P/PFZ >20,000SEMI Prime, 1Flat (57.5mm), MCC Lifetime>1,500µs, TTV<1µm, Bow<5µm, Empak cst
A23205684.00Intrinsic Si:-[100]6"500P/PFZ >20,000SEMI Prime, 1Flat (57.5mm), MCC Lifetime>1,000µs, TTV<1µm, Empak cst
A02735392.40Intrinsic Si:-[100]6"650P/PFZ >20,000SEMI Prime, 1Flat (57.5mm), MCC Lifetime>1,000µs, Empak cst
A21801630.00Intrinsic Si:-[100]6"650P/PFZ >20,000SEMI Prime, 1Flat (57.5mm), TTV<1µm, MCC Lifetime>1,000µs, Empak cst
B097410369.00Intrinsic Si:-[100]6"650C/CFZ >20,000Prime, NO Flats, MCC Lifetime>1,000µs, No Edge Rounding, Minor edge-chips, in Individual cst, Sold in packs of 5 wafers
B02575324.00Intrinsic Si:-[100]6"780P/PFZ >20,000SEMI Prime, 1Flat (57.5mm), MCC Lifetime>1,000µs, Empak cst
B15323468.00Intrinsic Si:-[100]6"1,000 ±50P/PFZ >20,000SEMI Prime, 1Flat (57.5mm), MCC Lifetime>1,000µs, Empak cst
K29910266.40Intrinsic Si:-[100]6"675P/PFZ >10,000SEMI Prime, 1Flat (57.5mm), Empak cst
A24151450.00Intrinsic Si:-[100]6"725P/PFZ >10,000SEMI Prime, 1Flat (57.5mm), Empak cst
D2331630.00Intrinsic Si:-[111] ±0.5°6"875P/PFZ >10,000SEMI Prime, 1Flat (57.5mm), Empak cst
B095410549.00p-type Si:B[17,10,10]6"700P/P7-MarSEMI Prime Notch, Empak cst
G0455176.40p-type Si:B[110] ±0.5°6"625P/E10--24SEMI Prime, 1Flat at <111>, Empak cst
C98010324.00p-type Si:B[100]6"285P/P10--30SEMI Prime, Notch, Empak cst
B150110104.40p-type Si:B[100]6"650P/P5--20NO Flats, Empak cst
B13432324.00p-type Si:B[100]6"650P/PFZ 8-13SEMI Prime, 1Flat (57.5mm), Empak cst
D2875176.40p-type Si:B[100] ±0.05°6"650P/PFZ 1-30SEMI Prime, 1Flat (57.5mm), MCC Lifetime>1,000µs, Empak cst
E28715176.40p-type Si:B[100] ±0.1°6"650P/PFZ 1-30SEMI Prime, 1Flat (57.5mm), MCC Lifetime>1,000µs, Empak cst
F23120158.40p-type Si:B[100]6"650P/PFZ 1-30 {1.379-1.382}SEMI Prime, 1Flat (57.5mm), MCC Lifetime>1,705µs, Empak cst
O57310450.00p-type Si:B[100] ±0.05°6"650P/PFZ 1-30SEMI Prime, 1Flat (57.5mm), TTV<1µm, Tight Surface & Flat Orientation tolerance, MCC Lifetime>1,000µs, Back-side LaserMark, Empak cst
A020612140.40p-type Si:B[100]6"675P/PFZ 1-30SEMI Prime, 1Flat (57.5mm), with LaserMark, Empak cst
A060010768.96p-type Si:B[100]6"675 ±5P/PFZ 1-30SEMI Prime, 1Flat (57.5mm), TTV<1µm, Empak cst
C2081900.00n-type Si:P[100] ±1°6"950 ±50P/PFZ >9,500SEMI Prime, 1Flat (57.5mm), MCC Lifetime>6,934µs, Empak cst
B21353576.00n-type Si:P[100]6"500 ±5P/PFZ 60-70SEMI Prime, 1Flat, MCC Lifetime>1,000µs, with Back-Side LaserMark, TTV<0.5µm, Empak cst
J3905234.00n-type Si:P[100]6"500 ±10P/PFZ 50-70 {57-62}SEMI Prime, 1Flat (57.5mm), Lifetime=15,799µs, Empak cst
H8835315.36n-type Si:P[100]6"625 ±5P/PFZ 40-90SEMI Prime, 1Flat (57.5mm), TTV<5µm, Empak cst
A13995360.00n-type Si:P[100]6"1,500 ±15P/PFZ 40-90SEMI Prime, 1Flat (57.5mm), MCC Lifetime>2,400µs, TTV<5µm, Empak cst
B22203273.96n-type Si:P[100]6"750 ±10P/PFZ 30-70SEMI Prime, 1Flat, MCC Lifetime>1,000µs, With Front-Side LaserMark, Empak cst
A092110206.28n-type Si:P[100]6"500 ±10P/PFZ 20-70SEMI Prime, 1Flat, Empak cst
A23522206.28n-type Si:P[100]6"500 ±10P/PFZ 20-70SEMI Prime, 1Flat, with Front-Side LaserMark, MCC Lifetime>1,000µs, Empak cst
B232410242.28n-type Si:P[100]6"500 ±10P/PFZ 20-70SEMI Prime, 1Flat, with Front-Side LaserMark, MCC Lifetime>1,000µs, Empak cst
E06410216.00n-type Si:P[111] ±0.5°6"425P/PFZ >3,000SEMI Prime, 2Flats, Empak cst
K34315338.40n-type Si:P[112-5° towards[11-1]] ±0.5°6"800 ±10P/PFZ >3,000SEMI Prime, 1 JEIDA Flat (47.5mm), TTV<4µm, MCC Lifetime>1,000µs, Empak cst
D8175504.00Intrinsic Si:-[100]6"650P/PFZ >65,000SEMI Prime, Notch, Empak cst
A75210395.64Intrinsic Si:-[100] ±0.1°6"720P/PFZ >65,000SEMI Prime, 1Flat (57.5mm), Empak cst
A196231,130.40Intrinsic Si:-[100-9.7°] ±0.5°6"500 ±5P/PFZ >20,000SEMI Prime, 1Flat (57.5mm), MCC Lifetime>1,500µs, TTV<1µm, Bow<5µm, Empak cst
A23205684.00Intrinsic Si:-[100]6"500P/PFZ >20,000SEMI Prime, 1Flat (57.5mm), MCC Lifetime>1,000µs, TTV<1µm, Empak cst
A02735392.40Intrinsic Si:-[100]6"650P/PFZ >20,000SEMI Prime, 1Flat (57.5mm), MCC Lifetime>1,000µs, Empak cst
A21801630.00Intrinsic Si:-[100]6"650P/PFZ >20,000SEMI Prime, 1Flat (57.5mm), TTV<1µm, MCC Lifetime>1,000µs, Empak cst
B097410369.00Intrinsic Si:-[100]6"650C/CFZ >20,000Prime, NO Flats, MCC Lifetime>1,000µs, No Edge Rounding, Minor edge-chips, in Individual cst, Sold in packs of 5 wafers
B02575324.00Intrinsic Si:-[100]6"780P/PFZ >20,000SEMI Prime, 1Flat (57.5mm), MCC Lifetime>1,000µs, Empak cst
B15323468.00Intrinsic Si:-[100]6"1,000 ±50P/PFZ >20,000SEMI Prime, 1Flat (57.5mm), MCC Lifetime>1,000µs, Empak cst
K29910266.40Intrinsic Si:-[100]6"675P/PFZ >10,000SEMI Prime, 1Flat (57.5mm), Empak cst
A24151450.00Intrinsic Si:-[100]6"725P/PFZ >10,000SEMI Prime, 1Flat (57.5mm), Empak cst
D2331630.00Intrinsic Si:-[111] ±0.5°6"875P/PFZ >10,000SEMI Prime, 1Flat (57.5mm), Empak cst
B095410549.00p-type Si:B[17,10,10]6"700P/P7-MarSEMI Prime Notch, Empak cst
G0455176.40p-type Si:B[110] ±0.5°6"625P/E10--24SEMI Prime, 1Flat at <111>, Empak cst
C98010324.00p-type Si:B[100]6"285P/P10--30SEMI Prime, Notch, Empak cst
B150110104.40p-type Si:B[100]6"650P/P5--20NO Flats, Empak cst
M83825356.40p-type Si:B[100-9.74°] ±0.1°6"275P/P1-100SEMI Prime, 1Flat (57.5mm), with LaserMark, Empak cst
L5865159.84p-type Si:B[100]6"400P/P1-100SEMI Prime, 1Flat (57.5mm), TTV<10µm, Bow/Warp<20µm, Empak cst
E4623159.84p-type Si:B[100]6"440P/E1--35SEMI Prime, 1Flat (57.5mm), Empak cst
B11222194.40p-type Si:B[100]6"480P/P1--35SEMI, 1Flat (57.5mm), Empak cst
A131210108.00p-type Si:B[100]6"650P/P1--5SEMI Prime, 1Flat (57.5mm), Empak cst
B160510284.40p-type Si:B[100]6"1,500P/P1-100SEMI Prime, 1Flat (57.5mm), TTV<1µm, Individual cst, Groups of 5 wafers
A13071302.40p-type Si:B[100]6"2,150 ±50P/P1-100SEMI Prime, 1Flat (57.5mm), TTV<1µm, Individual cst, In Groups of 2 wafers
A04443356.40p-type Si:B[100]6"2,200P/P1-100SEMI Prime, 1Flat (57.5mm), TTV<1µm, Individual cst
B04444230.40p-type Si:B[100]6"2,200P/P1-100SEMI Prime, 1Flat (57.5mm), TTV<10µm, Individual cst, Group of 4 wafers
A17615216.00p-type Si:B[100]6"2,975 ±50P/E1-100SEMI Prime, 1Flat (57.5mm), Individual cst, Groups of 5 wafers
117215216.00p-type Si:B[100]6"3,000 ±50P/E1-100SEMI Prime, 1Flat (57.5mm), Individual cst, Groups of 5 wafers
I0535107.64p-type Si:B[100]6"525P/P0.013-0.020SEMI Prime, 1Flat (57.5mm), Empak cst
S57945179.64p-type Si:B[100]6"275P/P0.01-0.02SEMI Prime, 1Flat (57.5mm), TTV<5µm, Empak cst
I5163179.64p-type Si:B[100]6"350 ±50P/P0.001-0.030SEMI Prime, 1Flat (57.5mm), Empak cst
A15135141.84p-type Si:B[100]6"650P/P0.001-0.005SEMI Prime, 1Flat (57.5mm), Empak cst
B12223213.84p-type Si:B[100]6"1,300P/P0.001-0.005SEMI Prime, 1Flat (57.5mm), Empak cst
D5615176.40p-type Si:B[100] ±0.1°6"400 ±10P/P<0.005SEMI Prime, 1Flat (57.5mm), Empak cst
A119911,674.00p-type Si:B[311] ±1°6"1,500 ±50P/P1-100Prime, 2Flats, Empak cst
A09535396.00p-type Si:B[755]6"675P/P>0.1SEMI notch Prime, Empak cst
B04204176.40n-type Si:Sb[110] ±0.5°6"625P/P0.01-0.02SEMI Prime, JEIDA Flat (47.5mm) at <001>, Empak cst
N7405122.40n-type Si:Sb[110] ±0.5°6"625P/P0.01-0.02SEMI Prime, JEIDA Flat (47.5mm) at <001>, Empak cst
S59275108.00n-type Si:P[100]6"625P/E30-60SEMI Prime, 1Flat (57.5mm), Empak cst
A18565622.80n-type Si:P[100]6"3,050 ±50P/P25-30SEMI Prime, 1Flat (57.5mm), TTV<5µm, in Individual csts, Packs of 5 wafers
B06401324.00n-type Si:P[100]6"1,300P/P15-35SEMI notch Prime, Empak cst
B21043230.40n-type Si:P[100]6"675P/P10--35SEMI Prime Notch, Laser Mark on front side, Empak cst
F2705216.00n-type Si:P[100]6"675P/P10--35SEMI notch Prime, TTV<2µm, Empak cst
G2705180.00n-type Si:P[100]6"675P/P10--35SEMI Notch Prime, TTV<5µm, LaserMark, Empak cst
K2863378.00n-type Si:P[100]6"2,600 ±50P/P10--35NO Flats, Individual cst in group of 3 wafers
A18182622.80n-type Si:P[100]6"3,093 ±50P/P10--35SEMI, 1Flat (57.5mm), Individual cst, Sold in groups of 1 wafer
C12721504.00n-type Si:P[100-9.74° towards[111]] ±0.1°6"500P/P5--35SEMI Prime, 1Flat (57.5mm), Front-Side LaserMark, Empak cst
F509890.00n-type Si:P[100]6"650P/P5--35SEMI Prime, 1Flat (57.5mm), Empak cst
A082510177.84n-type Si:P[100]6"700P/P5--35SEMI Prime, 1Flat(57.5mm), TTV<5µm, TIR<1µm, Bow<10µm, Warp<20µm, Empak cst
E3245161.64n-type Si:P[100]6"725P/P5--35SEMI Prime, 1 SEMI Flat(57.5mm), TTV<5µm, TIR<1µm, Bow<10µm, Warp<20µm, Wafers await final polish, Empak cst
J3245125.64n-type Si:P[100]6"725P/P5--35SEMI Prime, 1 JEIDA Flat(47.5mm), TTV<5µm, TIR<1µm, Bow<10µm, Warp<20µm, with Laser Mark, Empak cst
S58611572.00n-type Si:P[100]6"675 ±15P/E3--10SEMI Prime, 1Flat (57.5mm), Empak cst
S57811072.00n-type Si:P[100]6"675P/E2.7-4.0SEMI Prime, 1Flat, Empak cst
S58845504.00n-type Si:P[100]6"235 ±35P/P1--5SEMI Prime, 1Flat (57.5mm), Empak cst
E5568108.00n-type Si:P[100]6"475P/P1-100SEMI, 1Flat (57.5mm), TTV<5µm, Bow/Warp<15µm, with LaserMark, Empak cst
G0415179.64n-type Si:P[100]6"650P/P1-100JEIDA Prime, TTV<1µm, LaserMark, Empak cst
A094210324.00n-type Si:P[100]6"675P/P1-100SEMI notch Prime, TTV<5µm, with Back-Side Lasermark, Empak cst
C9465144.00n-type Si:P[100]6"675P/P1-100SEMI notch Prime, Lasermark. Extra low TTV for extra charge, Empak cst
D7166216.00n-type Si:P[100-28° towards[110]] ±1°6"675P/P1-100SEMI Notch Prime, TTV<5µm, Empak cst
D94610147.60n-type Si:P[100]6"700P/P1-100SEMI notch Prime, Empak cst
J3345324.00n-type Si:P[100-25° towards[110]] ±1°6"700P/P1-100SEMI notch Prime, Empak cst
G0895504.00n-type Si:P[100]6"1,875P/P1-100SEMI Prime, 1Flat (57.5mm), TTV<3µm, in stacked trays of 5 wafers
A23621176.40n-type Si:P[100]6"2,950 ±50P/P1-100SEMI Prime, 1Flat (57.5mm), Individual cst
102441242.64n-type Si:P[100]6"3,000P/P1--10SEMI Prime, 1Flat (57.5mm), in Individual csts, Sold Individually
A7115242.64n-type Si:P[100]6"3,000P/P1-100SEMI Prime, 1Flat (57.5mm), Individual cst, TTV<5µm, Sold in packs of 5 wafers
C05545702.00n-type Si:P[311] ±1°6"625P/P10--35Test, 2Flats, Empak cst
A05521702.00n-type Si:P[211] ±1°6"625P/P10--35Prime, 2Flats, Empak cst
A11695504.00n-type Si:P[522]6"625P/P10--35Prime, 2Flats, Empak cst
A1675576.00n-type Si:P[522] ±1°6"650P/P10--35SEMI Prime, 2Flats, Empak cst
B04573900.00n-type Si:P[522] ±1°6"650P/P10--35SEMI Prime, 2Flats, Empak cst
5" Wafers
Note: Surface - P = Polished, E = Etched, C = AsCut, G = Ground, Ox = Oxide (on that surface); Material - CZ unless noted
57441250.40p-type Si:B[100]5"920 ±10E/EFZ >1,000SEMI, 2 SEMI Flats, Empak cst
B10052144.00p-type Si:B[611] ±0.5°5"300 ±5P/PFZ 800-1,000SEMI Prime, 1Flat at <001>, MCC Lifetime>1,000µs, Empak cst
D863754.00n-type Si:P[100]5"400P/EFZ 7,000-14,300SEMI Prime, 1Flat, Bow/Warp<20µm, Empak cst
C863390.00n-type Si:P[100]5"350P/EFZ 5,000-10,000SEMI Prime, 1Flat, Bow/Warp<20µm, Empak cst
110231090.00n-type Si:P[111] ±0.5°5"275P/PFZ 7,000-20,000SEMI Prime, 2Flats, Empak cst
F083190.00n-type Si:P[111] ±0.1°5"200 ±15BROKENFZ >3,000BROKEN L/L wafers, in 2 pieces
S5598290.00p-type Si:B[100]5"228P/P1--10SEMI Prime, 1Flat, TTV<5µm, Empak cst
92281436.00p-type Si:B[100] ±1.0°5"525P/EOx0.002-0.004 {0.0031-0.0035}SEMI Prime, 1Flat, Free of Striations, TTV<5µm, Back-Side LTO seal 0.50±0.05µm thick, in Empak cassettes of 7 wafers
X2130189.00p-type Si:B[100]5"525P/EOxSEMI TEST, 2Flats, In Unsealed Empak cst
X71351114.40p-type Si:B[100]5"710 ±50E/E?SEMI TEST {Resistivity unknown}, 1Flat, In Unsealed Empak cst
TS0741222.68p-type Si:B[111-4°] ±0.5°5"538 ±13P/E3-6 {3.64-5.17}SEMI Prime, 1Flat, in Empak cst of 12+14 wafers
E683532.40p-type Si:B[111-3.5°] ±1.0°5"375 ±15P/EOx0.012-0.018 {0.0151-0.0153}SEMI Prime, 1Flat 42.5mm long at 15° CW from (110), Empak cst
TS003533.84n-type Si:As[100-1°] ±0.25°5"375P/EOx0.0010-0.0035 {0.0029-0.0032}SEMI, 1Flat, HBSD+LTO 800nm, Empak cst
X97001414.40n-type Si:Sb[100]5"550E/E<1RTP, SEMI Primary Flat, Secondary @ 135°, in Unsealed Empak cst
X97011014.40n-type Si:Sb[100]5"550E/E<1RTP, 1 Flat, In Opened Empak cst
X716789.00n-type Si:Sb[100]5"625E/ESEMI 2Flats (2nd @135°), 125.63mm diameter, in Unsealed Empak csts
X6989514.40n-type Si:As[100]5"650E/E<1RTP, Primary Flat, Secondary @ 180°, In Unsealed Empak cst
TS0601333.84n-type Si:P[111-4°] ±0.5°5"430 ±100P/EOx0.001-0.002 {0.0014-0.0017}SEMI Prime, 1Flat, Back-side LTO 850nm thick, Wafer thickness measured 500±5µm, Free of Striations, Empak cst
7188510.80n-type Si:As[111]5"525E/E0.001-0.005SEMI TEST - No CofC, 1Flat, Back-side Oxide seal, in Unsealed Empak cassettes
X9114632.40n-type Si:?[100]5"?P/EOx?SEMI TEST, 2Flats (SF @ 180°), Back-side LTO seal, In Unsealed Empak cst
X1991414.40n-type Si:?[100]5"?P/E?SEMI TEST, 2Flats (2nd @ 180°), sealed Empak cst
X728955.40n-type Si[111-4°]5"375P/ESEMI TEST, 2Flats (SF 45° from PF), in Unsealed Empak cst
E80417151.20p-type Si:B[100]5"762P/PFZ 2,000-3,000SEMI Prime, 1Flat, TTV<2µm, Bow<10µm, Warp<20µm, Empak cst
H74415140.40p-type Si:B[100]5"750P/PFZ >1,000SEMI Prime, 2Flats, Empak cst
C2378490.00p-type Si:B[100]5"800P/PFZ >1,000SEMI Prime, 2Flats, Empak cst
D10055623.52p-type Si:B[100-10° towards[110]] ±0.5°5"300 ±5P/PFZ 800-1,000SEMI Prime, 1Flat, MCC Lifetime>1,000µs, Empak cst
77731071.28p-type Si:B[100]5"610P/P16-24SEMI Prime, 2Flats, Empak cst
D86810176.40p-type Si:B[100]5"590P/P1--35SEMI Prime with Notch, TTV<1µm, Bow/Warp<10µm, Empak cst
A06805161.28p-type Si:B[100]5"950P/P1--20SEMI Prime, 1Flat, Empak cst
A68310216.00n-type Si:P[100]5"762 ±12P/P5--35SEMI Prime, 1Flat, TTV<1µm, Bow<5µm, Warp<10µm, Measurements and thickness maps for each wafers, Empak cst
B145910396.00n-type Si:P[100]5"762 ±12P/P5--35SEMI Prime, 1Flat, TTV<1µm, Empak cst
4" Wafers
A22422612.00Intrinsic Si:-[553] ±0.3°4"300 ±15P/PFZ >20,000SEMI Prime, 1Flatat <110>, MCC Lifetime>1,500µs, TTV<5µm, Empak cst
H77511216.00p-type Si:B[110] ±0.5°4"1,650P/E10--15SEMI Prime, 1Flat at <1,-1,0>, Empak cst
A16345177.84p-type Si:B[110] ±1°4"2,000P/P1--20Prime, 1Flat at <111>±0.5°, Individual csts in Group of 5 wafers
S77981153.28p-type Si:B[100]4"595 ±15E/E25-45SEMI Prime, 2Flats, Empak cst
4959764.80p-type Si:B[100]4"525NP/PN10--20SEMI Prime, 2Flats, with 150nm of LPCVD Stoichiometric Silicon Nitride on both sides, Empak cst
A09954180.00p-type Si:B[100]4"550P/P10--20SEMI Prime, 2Flats, TTV<1µm, Empak cst
12159471.28p-type Si:B[100]4"200P/P5--10SEMI Prime, 1Flat, Empak cst
73051159.84p-type Si:B[100]4"300P/P5--10SEMI Prime, 2Flats, Empak cst
A2151385.68p-type Si:B[100]4"300P/P5--10SEMI Prime, 2Flats, Empak cst
F060436.00p-type Si:B[100]4"300P/P5--10SEMI TEST (Scratched - can be repolished for extra fee), 2Flats, in Unsealed Empak cst
5727218.00p-type Si:B[100]4"380P/E5--10SEMI TEST (unsealed), 2Flats, Empak cst
D819190.00p-type Si:B[100]4"380P/E5--10SEMI Prime, 1Flat, Back-side slightly darker than normal, in hard cst
C815218.00p-type Si:B[100]4"380BROKEN5--10Broken P/E Wafers, 1Flat, in Empak
D259218.00p-type Si:B[100]4"380BROKEN5--10Broken P/E Wafers, 2Flats, in Empak
D649154.00p-type Si:B[100]4"380BROKEN5--10Broken (largest piece is ~30%), 1Flat, in Empak
A13559198.00p-type Si:B[100]4"475P/E5--10SEMI 1Flat, Both sides polished (Front Prime and Epi-Ready, Back scratched), TTV<0.3µm, Empak cst
A1679445.00p-type Si:B[100]4"525P/P5--25SEMI Prime, 2Flats, TTV<5µm, Empak cst
111961523.76p-type Si:B[100]4"525P/E5--10SEMI Prime, 2Flats, TTV<5µm, Empak cst
A05583269.28p-type Si:B[100]4"640 ±10P/P5--10SEMI, 2Flats, TTV<1µm, Empak cst
A19911158.40p-type Si:B[100]4"2,000P/P5--10Good Front side, Back-Side with large scratch on back, SEMI, 1Flat, TTV<5µm, Individual cst
104361720.00p-type Si:B[100]4"25,000 ±50C/C4--10SEMI, 1Flat, TTV<30µm, Bow/Warp<40µm, Individual cst
B12854122.40p-type Si:B[100]4"350P/P2--10SEMI Prime, 1Flat, TTV<5µm, Empak cst
116891564.80p-type Si:B[100]4"200P/P1-20 {1.2-4.2}SEMI Prime, 1Flat, Empak cst
G997627.00p-type Si:B[100]4"300P/P1--10SEMI TEST (Surface Defects), 2Flats, Empak cst
E485354.00p-type Si:B[100-4° towards[110]] ±0.5°4"300P/E1--10SEMI TEST (Surface pits), 2Flats, Empak cst
A0587354.00p-type Si:B[100]4"360P/E1--20SEMI Prime, 1Flat, Empak cst
G189736.00p-type Si:B[100]4"475P/E1--10SEMI Prime, 2Flats, Epi edges for 150µm Epi growth, Empak cst
F263119.00p-type Si:B[100]4"480C/C1--35SEMI TEST (Unpolished wafers with edge chips), 2Flats, Empak cst
119885158.40p-type Si:B[100]4"500P/P1-100SEMI Prime, 1Flat, Front-side LaserMark, TTV<1µm, Empak cst
A13481180.00p-type Si:B[100]4"500P/P1--10SEMI Prime, 1Flat, TTV<1µm, Empak cst
K440743.20p-type Si:B[100]4"500P/P1--50SEMI Prime, 2Flats, Carbon (0.9-1.1)E16/cc per ASTM F1319, Oxygen (8.4-8.0)E17/cc per ASTM F1188, Empak cst
A1021890.00p-type Si:B[100]4"525P/P>1SEMI Prime, 1Flat, TTV<2µm, Empak cst
A1458390.00p-type Si:B[100]4"525 ±35P/P1--20SEMI Prime, 2Flats, TTV<2µm, Empak cst
F3071210.80p-type Si:B[100]4"525P/P1--10SEMI TEST (Unsealed, dirt and defects on wafers), 2Flats, Empak cst
A2278589.28p-type Si:B[100]4"525P/E1--5SEMI Prime, 2Flats, With Back-Side LaserMark, TTV<5µm, Empak cst
F485890.00p-type Si:B[100]4"5251--20SEMI TEST (Spotted defect) - wafers with three layers of SiO2 and Ge deposited by Electron Beam Evaporation, 2Flats, Empak cst
S58701228.08p-type Si:B[100-0.5°]4"575 ±10E/E1--10SEMI, 2Flats, Empak cst
S77991133.84p-type Si:B[100]4"590 ±10E/E1--10SEMI, 2Flats, Empak cst
C2731450.00p-type Si:B[100]4"620 ±1P/PJan-50SEMI TEST (Scratched), 2 Flats, Ultra flat TTV<0.25µm, Bow<1µm, Warp<6µm, Wafer with LaserMark and meaurements, Can be repolished for additional fee, Empak cst
B512290.00p-type Si:B[100]4"700 ±50P/P2--8SEMI TEST (Defective, scratched, high TTV), 2Flats, in Unsealed Empak cst
S1020271.64p-type Si:B[100]4"1,000P/E>1SEMI TEST and unsealed, Empak cst
A1075190.00p-type Si:B[100]4"2,950 ±50P/P1--35SEMI TEST (Scratched), 2Flats, in Unsealed Individual cst
A23174212.40p-type Si:B[100]4"2,950P/P1--35SEMI Prime, 2Flats, Individual cst in Group of 4 wafers
1181410176.40p-type Si:B[100]4"3,000P/E1--35SEMI Prime, 2Flats, Individual cst in Groups of 10 wafers
A0494190.00p-type Si:B[100]4"3,000P/E1--35SEMI TEST (Scratched), 1Flat, Individual cst
B1079359.40p-type Si:B[100]4"3,000P/E1--35SEMI TEST (2 wafers with Chips, 1 wafer Scratched), 2Flats, in Indivicual csts, sold in pack of 3 wafers
5737484.24p-type Si:B[100]4"890 ±15P/P0.5-10.0SEMI TEST (Scratches), ~100 small holes through wafer in pattern, 1Flat, TTV<8µm, Empak cst
A0149963.00p-type Si:B[100]99.25 mm3,000C/C0.5-0.61Flat, Small diameter: 99.25±0.25mm, Packs of 4 & 5 wafers
B20558160.56p-type Si:B[100-4° towards[110]] ±0.5°4"300P/E0.1-1.5 {0.52-0.63}SEMI Prime, 2Flats, TTV<5µm, Empak cst
79543219.60p-type Si:B[100]4"445 ±15P/P0.1-0.2SEMI Prime, 2Flats, TTV<5µm, Empak cst
A04482241.20p-type Si:B[100-9.7° towards[110]] ±0.5°4"525P/P0.02-1.00SEMI Prime, 2Flats, Empak cst
30311635.64p-type Si:B[100-6° towards[110]] ±0.5°4"525P/E0.015-0.020SEMI Prime, 2Flats, Empak cst
110281530.24p-type Si:B[100-6° towards[110]] ±0.5°4"525P/E0.005-0.025SEMI Prime, 2Flats (PF @ 110±1°, SF @ 90±5° CW from PF), TTV<5µm, Empak cst
5419350.40p-type Si:B[100]4"300P/P0.001-0.005SEMI TEST (Scratches on both sides), 2Flats, TTV<5µm, Empak cst
69193140.40p-type Si:B[100]4"300P/E0.001-0.010SEMI Prime, 2Flats, Empak cst
D919290.00p-type Si:B[100]4"300P/E0.001-0.010SEMI TEST (scratches, in unsealed cst), 2Flats, Back-side LaserMark, Empak cst
A13545612.00p-type Si:B[100]25.6x25.6mm500P/P0.001-0.005Prime 25.6x25.6mm Silicon Frames
N135272.00p-type Si:B[100]4"500P/P0.001-0.005SEMI Prime, 2Flats, Some with striation marks, Empak cst
A9681900.00p-type Si:B[100]4"500L/L0.001-0.200Set of 4 Lapped wafer Resistivity Standards (0.007, 0.015, 0.035, 0.127) Ohmcm, in Individual cst
A1191436.00p-type Si:B[100]4"525P/P0.001-0.005SEMI Prime, 1Flat, TTV<5µm, Free of Striations, Empak cst
A04492100.80p-type Si:B[100]4"525P/E0.001-0.005 {0.0013-0.0033}SEMI Prime, 2Flats, TTV<5µm, Free of Striations, Empak cst
54201017.64p-type Si:B[100]4"800C/C0.001-0.005SEMI, 2Flats, Some with striation marks, Empak cst
A14769143.64p-type Si:B[100]4"2,000P/E0.001-0.007SEMI Prime, 2Flats, Individual cst, Sold as Group of 9 wafers
1071712197.28p-type Si:B[100] ±1°4"625P/E0.0007-0.0013SEMI Prime, 1Flat, with LaseMark, Empak cst
S5774190.00p-type Si:B[100]4"?P/P?SEMI TEST, 2Flats, Empak cst
B19781468.00p-type Si:B[331] ±0.5°4"475P/P0.001-0.002Prime, One Flat ([1-10]), TTV<5µm, Bow/Warp<10µm, Empak cst
A22363176.40p-type Si:B[111-0.2° towards[11-2]] ±0.1°4"380P/E10--20SEMI Prime, 1Flat, Empak cst
1014714315.00p-type Si:B[111-2.5°] ±1°4"450NOP/EON2--8SEMI Prime, 1Flat, Both sides with 2µm SiO2, both sides with 250nm low stress silicon nitride over the oxide, Empak cst
120281226.64p-type Si:B[111] ±0.5°4"525P/E1--5SEMI Prime, 1Flat, TTV<5µm, Bow<15µm, Warp<30µm, Empak cst
D3721317.28p-type Si:B[111-3°]4"400P/E0.015-0.018SEMI Prime, 1Flat, Empak cst
110841523.04p-type Si:B[111-4° towards[110]]4"400P/E0.002-0.008SEMI Prime, 1Flat, Empak cst
A18494154.44p-type Si:B[111] ±0.5°4"335P/P0.001-0.005SEMI Prime, 1Flat, TTV<1µm, Empak cst
X913647.20p-type Si:B[111-4°]4"550E/E0.001-100SEMI TEST (Resistivity unknown), 1Flat, In Unsealed Empak cst
X2183137.20p-type Si:B[111-4°]4"555E/E0.001-100SEMI TEST (Resistivity unknown), 1Flat, Unsealed Empak cst
F0228158.40p-type Si:B[111] ±0.3°4"350 ±5P/P<0.05SEMI Prime, 1Flat, TTV<1µm, Bow/Warp<15µm, Empak cst
X701227.20p-type Si:B[111-4°]4"520 ±10E/EIn Unsealed Empak cst
X727257.20p-type Si:B[111-4°]4"P/ESEMI TEST, 1Flat, In Unsealed Empak cst
X701337.20p-type Si:B[111-4°]4"550 ±15E/ETEST, 1Flat, In Unsealed Empak cst
A8547218.88p-type Si:B[753] ±0.5°4"300 ±15P/P1-100SEMI Prime, 1 Flat 32.5mm @ <211>, TTV<3µm, Empak cst
114001226.64n-type Si:P[110] ±0.5°4"525P/E4--6SEMI Prime, 2 Flats at [111], SF 30° CW from PF, Empak cst
40241162.64n-type Si:As[110] ±0.5°4"275P/P0.001-0.005SEMI TEST (Haze, scratches, TTV<15µm), PF at [111] ±0.5°, SF at [111] CW 70.5° ±5° from PF, Empak cst
12295 15 123.84 n-type Si:As [110] ±0.5° 4" 500 P/P 0.001-0.005 SEMI Prime, 2Flats (PF at <111>,
- SF at <111> CW 70.5° ±5° from PF), Empak cst
115821053.28n-type Si:P[100]4"400P/E32-70SEMI Prime, 2Flats, Empak cst
A18131216.00n-type Si:P[100-0.60° towards[110]] ±0.05°4"525P/E5--10SEMI Prime, 2Flats, Empak cst
E830821.60n-type Si:P[100]4"350P/P3--5SEMI TEST (Haze, pits, scratches), 2Flats, Empak cst
C925149.00n-type Si:P[100]4"500 ±10P/P2--5SEMI TEST (wafers have spots resembling water splashes, which do not come off), 2Flats, in hard cassettes of 4, 5 & 5 wafers
A20551388.56n-type Si:P[100-4° towards[110]] ±0.5°4"300P/E1-5 {1.06-1.84}SEMI Prime, 2Flats, TTV<5µm, Empak cst
S57631127.00n-type Si:P[100] ±1°4"465 ±10E/E1--3SEMI, 1Flat, Empak cst
649710140.40n-type Si:P[100-25° towards[110]] ±0.5°4"500P/P1-100SEMI Prime, 2Flats, TTV<5µm, Empak cst
F0709890.00n-type Si:P[100]101mm525P/P1-100SEMI Prime, 1Flat, TTV<5µm, Empak cst
S59321720.00n-type Si:P[100]4"20,000 ±100P/E1--10SEMI TEST (Polishing Defects), NO Flats, in Unsealed Individual cst
1190612124.56n-type Si:P[100]4"500P/P0.5-0.6SEMI Prime, 2Flats, Empak cst
B1876188.56n-type Si:P[100]4"500P/P0.5-0.6SEMI Prime, 2Flats, Empak cst
E1341425.20n-type Si:P[100]4"275P/P0.10-0.15SEMI TEST (Scratches on both sides), 2Flats, Empak cst
A22832285.48n-type Si:P[100]4"190P/P0.05-0.15SEMI Prime, 2Flats, Bow<5µm, Empak cst
A07961095.04n-type Si:P[100]4"250P/P0.05-0.20SEMI Prime, 1Flat, Empak cst
E031353.28n-type Si:Sb[100-6° towards[110]] ±0.5°4"525P/E0.015-0.020SEMI Prime, 2Flats, Empak cst
A14542125.64n-type Si:Sb[100] ±0.3°4"292.5 ±2.5P/P0.01-0.02SEMI Prime, 2Flats, TTV<5µm, Empak cst
A2422872.00n-type Si:Sb[100]4"300 ±15P/P0.01-0.02SEMI Prime, 2Flats, With Front-Side LaserMark, TTV<5µm, Empak cst
E1673974.88n-type Si:Sb[100] ±0.2°4"300 ±5P/P0.01-0.02 {0.012-0.018}SEMI Prime, 2Flats, TTV<3µm, Empak cst
S588815104.40n-type Si:Sb[100] ±1°4"300P/P0.01-0.02SEMI Prime, 2Flats, Empak cst
TS126630.24n-type Si:Sb[100] ±1°4"300P/E0.01-0.02 {0.014-0.016}SEMI Prime, 2Flats, Empak cst (24+4+3 wafers)
F16731777.04n-type Si:Sb[100] ±0.2°4"302 ±3P/P0.01-0.02 {0.012-0.018}SEMI Prime, 2Flats, TTV<3µm, Empak cst
1140813122.40n-type Si:Sb[100] ±0.2°4"325 ±15P/P0.01-0.02 {0.011-0.019}SEMI Prime, 2Flats, TTV<5µm, Empak cst
TS0271535.28n-type Si:Sb[100-2.5°] ±0.5°4"380 ±10P/POx0.01-0.02 {0.012-0.014}SEMI Prime, 2Flats, TTV<5µm, Back-side LTO 500±100nm, Empak cst
B03631354.00n-type Si:Sb[100]4"400 ±5P/P0.01-0.02 {0.0149-0.0156}SEMI Prime, 2Flats, Empak cst
C0363672.00n-type Si:Sb[100]4"500 ±5P/P0.01-0.02 {0.0149-0.0156}SEMI Prime, 2Flats, Empak cst
S1045868.40n-type Si:Sb[100]4"500P/P0.010-0.025SEMI Prime, 2Flats, Empak cst
106486159.12n-type Si:Sb[100-4°] ±0.5°4"1,500 ±50P/P0.005-0.030SEMI Prime, 2Flats, Empak cst
TS127528.80n-type Si:As[100] ±1°4"360 ±15P/P0.004-0.008 {0.0054-0.0067}SEMI Prime, 2Flats, TTV<5µm, Empak csts (21+20+20+19+18 wafers)
U6711528.80n-type Si:As[100]4"545E/E0.002-0.004SEMI, 1Flat, Empak cst
1014859.00n-type Si:As[100]4"525P/E0.001-0.005SEMI TEST (unsealed, dirty), 2Flats, TTV<5µm, Unsealed csts of 5 & 18 wafers
F562 3 180.00 n-type Si:As [100] 4" 525 PlyAP/E 0.001-0.005 With layer of Al2O3, ~0.1µm or ~0.05µm thick, Wafers with a matrix of Polycrystalline Silicon dots, Empak cst,
- [More Info]
A20062648.00n-type Si:Sb[331] ±0.5°4"300 ±15P/P0.01-0.02Prime, TTV<5µm, One Flat at <1,-1,0>, 32.5±2.5mm long, Empak cst
F9754216.00n-type Si:Sb[211] ±0.5°4"1,600 ±100C/C0.01-0.02SEMI, 1Flat, Wafers can be polished for additional fee, Empak cst
E3951067.68n-type Si:P[111]4"1,200P/P35-85SEMI Prime, 2Flats, Empak cst
Q3621635.64n-type Si:P[111] ±0.5°4"280P/E1.3-2.7SEMI Prime, 2Flats, Empak cst
A0289454.00n-type Si:P[111] ±0.25°4"500P/E1-100SEMI Prime, 2Flats, Empak cst
56379140.40n-type Si:P[111] ±0.5°4"750P/P1-100 {10-13}SEMI Prime, 2Flats, TTV<5µm, Bow/Warp<10µm, Empak cst
1051721,044.00n-type Si:P[111] ±0.5°4"10,000 ±50P/E1-100Prime, NO Flats, Individual cst, Sold individually
A08223122.40n-type Si:P[111] ±0.5°4"700P/P0.15-5.00SEMI Prime, NO Flats, with LaserMark, Empak cst
A2212290.00n-type Si:Sb[111] ±0.5°4"500P/E0.018-0.020SEMI Prime, 2Flats, Empak cst
TS1181014.76n-type Si:Sb[111-4°] ±0.5°4"381P/E0.008-0.020 {0.0116-0.0194}SEMI Prime, 2Flats, HBSD (sand-blasted back-side), in Empak csts of 10×22+24+21 wafers
TS1191046.44n-type Si:Sb[111-4°] ±0.5°4"381P/E0.008-0.020 {0.0108-0.0141}SEMI Prime, 2Flats, HBSD (sand-blasted back-side), Empak cst (7+3 wafers)
TS139535.64n-type Si:Sb[111-4°] ±0.5°4"381P/E0.008-0.020SEMI Prime, 2Flats, HBSD (sand-blasted back-side), Empak cst (2+5+14+15+18 wafers)
TS015726.64n-type Si:Sb[111-1.5°] ±0.15°4"525P/EOx0.005-0.018 {0.0129-0.0161}SEMI Prime, 2Flats, Back-side LTO 400nm thick, Empak cst
TS0654417.64n-type Si:Sb[111-3°] ±0.2°4"525P/E0.005-0.015 {0.0117-0.0143}SEMI Prime, 2Flats, Empak cst
TS0451224.48n-type Si:As[111-2.5°] ±0.5°4"525P/EOx0.003-0.004 {0.0034-0.0037}SEMI Prime, 2Flats, TTV<4µm, Back-side: LTO 500nm, Empak cst
TS122715.84n-type Si:As[111-4°] ±0.5°4"525P/E0.002-0.005 {0.0027-0.0033}SEMI Prime, 2Flats, HBSD (back-side sand-blasted), TTV<8µm, in Empak csts of 22+22+16+11+7+4 wafers
TS123515.84n-type Si:As[111-4°] ±0.5°4"525P/E0.0020-0.0035 {0.0017-0.0030}SEMI Prime, 2Flats, TTV<8µm, in Empak csts of 22 wafers plus several partial csts
TS159821.60n-type Si:As[111-4°] ±0.5°4"280 ±15P/E0.001-0.004SEMI Prime, 2Flats {PF 32.5mm at <110>, SF 90° from PF (not 45°)}, Empak
D7411476.86n-type Si:As[111-4°] ±0.5°4"325P/EOx0.001-0.005SEMI Prime, 2Flats, Back-side Sand-blasted with LTO seal, in Empak cassettes (7 + 7 wafers)
J6561515.84n-type Si:As[111-4°]4"525P/E0.001-0.005SEMI Prime, 2Flats, Empak cst
TS0301215.84n-type Si:As[111-4°] ±0.5°4"525P/E0.001-0.005 {0.0036-0.0044}SEMI Prime, 2Flats, Empak (several partial csts)
TS141915.84n-type Si:As[111-3.5°] ±0.5°4"525P/E0.001-0.005 {0.0039-0.0045}SEMI Prime, 2Flats, HBSD (sand-blasted back-side), Taper<5µm, Empak cst of 12+12+17+18 wafers
TS1641415.84n-type Si:As[111-4°] ±0.5°4"525P/E0.001-0.005 {0.0036-0.0044}SEMI Prime, 2Flats, Empak (several partial csts)
X720947.20n-type Si:As[111-4°]4"625E/E0.001-0.005RTP wafers, SEMI 2Flats (SF 45° from PF), in Unsealed Empak cst
35561132.76n-type Si:As[111] ±0.5°4"1,000P/E0.001-0.005 {0.0031-0.0040}SEMI Prime, 2Flats, TTV<4µm, Bow<10µm, Warp<20µm, Empak cst
S5775345.00Si?4"?P/P?SEMI, in Unsealed Empak cst
5784418.00Si[110] ±0.5°4"525C/C?In Unsealed Empak cst
X720147.20Si:?[111-4°]4"P/ESEMI 1Flat, Resistivity unknown, In Unsealed Empak cst
1181113158.40p-type Si:B[100]4"500OxP/POx1--10SEMI Prime, 2Flats, DRY Thermal Oxide 50±5nm thick on both sides, Empak cst
3" Wafers
Note: Surface - P = Polished, E = Etched, C = AsCut, G = Ground, Ox = Oxide (on that surface); Material - CZ unless noted
Item Qty in Price Material Orient. Diam. Thck Surf. Resistivity Comment
Stock $/wafer (µm) Ωcm
A143510$ 82.80p-type Si:B[100]3"380P/PFZ 1-20SEMI Prime, 1Flat, MCC Lifetime>500µs, Empak cst
A057212$ 89.28p-type Si:B[100]3"500P/PFZ 0.5-10.0SEMI Prime, 2Flats, Empak cst
I2463$ 71.28p-type Si:B[100]3"525P/EFZ 0.5-10.0SEMI Prime, 2Flats, Empak cst
S590113$ 53.28p-type Si:B[100]3"584E/EFZ 0.5-10.0SEMI, 2Flats, Empak cst
M9425$ 107.64p-type Si:B[111] ±0.5°3"475P/EFZ >4,400SEMI Prime, 1Flat, TTV<5µm, Empak cst
S55544$ 105.30p-type Si:B[111] ±0.25°3"400P/EFZ >100SEMI Prime, 1Flat, Empak cst
A14485$ 207.36p-type Si:B[111-4° towards[110]] ±0.5°3"380P/PFZ 1-5SEMI Prime, 1Flat, TTV<5µm, MCC Lifetime>3,000µs, Empak cst
F4212$ 69.84n-type Si:P[100]3"300P/PFZ 45-52SEMI Prime, 2Flats, Empak cst
705912$ 68.40n-type Si:P[100]3"850P/EFZ 40-140SEMI Prime, 2Flats, Empak cst
57537$ 143.28n-type Si:P[211-5°] ±0.5°3"508P/PFZ >50Prime, 1Flat, Empak cst
575013$ 125.28n-type Si:P[211-5°] ±0.5°3"508P/PFZ 25-75Prime, 1Flat, Empak cst
57527$ 143.28n-type Si:P[211-5°] ±0.5°3"508P/PFZ 25-75Prime, 1Flat, Empak cst
57584$ 179.64n-type Si:P[211] ±0.5°3"508P/PFZ 25-75Prime, 1Flat, Empak cst
57549$ 130.68n-type Si:P[211] ±0.5°3"1,016P/PFZ 25-75Prime, 1Flat, Empak cst
G1166$ 32.40n-type Si:P[111] ±0.5°3"415 ±15E/EFZ 10,000-12,000SEMI, 1Flat, MCC Lifetime>1,500µs, Empak cst
57074$ 86.40n-type Si:P[111] ±0.5°3"370P/EFZ >5,000SEMI Prime, 1Flat, Empak cst
F2641$ 328.68n-type Si:P[111] ±0.5°3"675P/PFZ >5,000SEMI Prime, 1Flat, TTV<4µm, MCC Lifetime>800µs, Empak cst
I9783$ 140.40n-type Si:P[111] ±0.5°3"380P/EFZ 4,000-8,000SEMI Prime, 1Flat, in hard cassettes of 1 & 2 wafers
K9781$ 90.00n-type Si:P[111] ±0.5°3"380BROKENFZ 4,000-8,000Broken P/E wafer, 1Flat, Soft cst
211613$ 32.40n-type Si:P[111] ±0.5°3"415 ±15E/EFZ 2,000-5,000SEMI Prime, 1Flat, MCC Lifetime>1,500µs, Empak cst
H9147$ 89.64n-type Si:P[111] ±1.0°3"450P/PFZ 182-196SEMI Prime, 1Flat, Empak cst
G01285$ 143.64Intrinsic Si:-[100]3"380P/EFZ >20,000SEMI Prime, 1Flat, MCC Lifetime>1,000µs, Empak cst
K8341$ 159.84Intrinsic Si:-[100]3"380P/EFZ >20,000SEMI TEST (unpolished side has stain), 1Flat, Empak cst
A20302$ 176.40Intrinsic Si:-[100]3"381P/EFZ >20,000 {20,630-90,500}SEMI Prime, TTV<5µm, Empak cst
1146310$ 78.48Intrinsic Si:-[111] ±0.5°3"380P/EFZ >20,000SEMI Prime, 1Flat, MCC Lifetime>1,000µs, Empak cst
I6675$ 140.40p-type Si:B[110] ±0.5°3"380P/E>100SEMI Prime, 2Flats (PF @ [111], SF @ [111] CW 70.5° from PF), in Empak cassettes of 1, 2 & 2 wafers
592815$ 51.84p-type Si:B[110]3"750P/E>100SEMI Prime, 2Flats {PF at [111], SF at [111] CW 70.5° from PF}, Empak cst
S580612$ 45.00p-type Si:B[110] ±0.5°3"860E/E15-50SEMI, 2Flats, Empak cst
E45516$ 23.04p-type Si:B[110] ±0.5°3"381P/E0.003-0.005SEMI Prime, Primary Flat @ [111]±0.5°, Secondary Flat @ [111] CW 109.5±2° from PF, Empak cst
111217$ 17.64p-type Si:B[100]3"380P/E7--9SEMI Prime, 2Flats, TTV<5µm, Empak cst (Cassettes of 17 & 15 wafers)
K34210$ 23.04p-type Si:B[100]3"300P/P5--10SEMI Prime, 2Flats, Empak cst
777810$ 23.04p-type Si:B[100]3"300P/P1--10SEMI Prime, 2Flats, Empak cst
I7332$ 450.00p-type Si:B[100]3"380FeP/E1-100SEMI Prime, 2Flats, with Thin film of Iron (Fe), 25±15nm thick on polished side, Empak cst
S58656$ 54.00p-type Si:B[100-6° towards[110]] ±0.5°3"381P/E1--10SEMI Prime, 2Flats, Empak cst
68267$ 270.00p-type Si:B[100]3"475P/P1--50SEMI Prime, 2Flats, Ultra flat TTV<0.3µm, Empak cst
P34314$ 68.40p-type Si:B[100]3"500P/P1-100SEMI Prime, 1Flat, Empak cst
O3449$ 86.40p-type Si:B[100]3"600P/P1-100Prime, 1Flat, Empak cst
A091610$ 179.28p-type Si:B[100]3"640P/P1-100SEMI Prime, 2Flats, TTV<1µm, Front LaserMark, Empak cst
C05831$ 288.00p-type Si:B[100]3"2,000P/P1--20SEMI Prime, 2Flats, Individual cst
43947$ 54.00p-type Si:B[100]3"300P/P0.5-10.0SEMI Prime, 1Flat, TTV<2µm, Empak cst
S58537$ 107.64p-type Si:B[100]3"315P/P0.5-10.0SEMI Prime, 1Flat, TTV<3µm, Empak cst
L2711$ 338.40p-type Si:B[100] ±1°3"318 ±7P/P0.5-10.0SEMI Prime, 2Flats, TTV<1µm, Empak cst
T2068$ 57.60p-type Si:B[100]3"3,050 ±50C/C>0.51Flat, Individual cst (can be ordered singly)
J0149$ 18.00p-type Si:B[100]3"250BROKEN0.15-0.20Broken wafers, in Epak cst
H55810$ 68.40p-type Si:B[100]3"356P/P0.015-0.020SEMI Prime, 2Flats, Empak cst
I6009$ 46.80p-type Si:B[100]3"185P/P0.01-0.04SEMI Prime, 1Flat, Empak cst
22481$ 90.00p-type Si:B[100]3"300P/E0.01-0.02SEMI Prime, 2Flats, Empak cst
G9891$ 90.00p-type Si:B[100]3"380P/P0.01-0.02SEMI Prime, 2Flats, Empak cst
TS1302$ 90.00p-type Si:B[100]3"381P/E0.002-0.005 {0.0037-0.0039}SEMI Prime, 2Flats, TTV<7µm, Free of Striations, Empak cst
1195714$ 720.00p-type Si:B[100]3"50 ±5P/P0.0012-0.0015SEMI Prime, 1Flat, TTV<5µm, Empak cst, In Groups of 2 wafers
A19578$ 540.00p-type Si:B[100]3"50 ±5BROKEN0.0012-0.00151Flat, TTV<5µm, Group of 8 wafers individually packed: 2 wafers cracked in half, 5 with chips and 1 with crack on edge, sold as a sealed set of 8 wafers for $300
S58667$ 54.00p-type Si:B[100]3"390 ±10E/E<100SEMI, 2Flats, coin roll
336610$ 176.40p-type Si:B[5,5,12] ±0.5°3"380P/E1--10SEMI Prime, One Flat, Empak cst
69498$ 119.88p-type Si:B[111]3"2,300P/P4--7SEMI Prime, 1Flat, Individual cst, In Group of 8 wafers
A18984$ 159.48p-type Si:B[111] ±0.02°3"350P/P1--10SEMI Prime, 1Flat, Empak cst
A0683$ 141.12p-type Si:B[111] ±0.5°3"458P/P0.80-1.05SEMI Prime, 1Flat, Empak cst
A17434$ 79.92p-type Si:B[111] ±0.5°3"300P/P0.3-0.4 {0.33-0.36}SEMI Prime, 1Flat, TTV<5µm, Empak cst
H12010$ 26.64p-type Si:B[111-4°] ±0.5°3"381P/EOx0.01-0.02 {0.0145-0.0148}SEMI Prime, 1Flat, Back-side LTO 0.35±0.05µm thick, Empak cst
S590913$ 35.64p-type Si:B[111-4° towards[-211]] ±0.5°3"890P/E0.001-0.005SEMI TEST (Can be repolished), 2Flats, Soft cst
A2089$ 113.04n-type Si:P[510] ±0.5°3"1,000P/E1-100Prime, NO Flats, Back-side rough etched, Empak cst
F0922$ 284.94n-type Si:P[110] ±0.5°3"381P/E11--15SEMI Prime, 2Flats, TTV<15µm, Individual cst
C72014$ 87.84n-type Si:P[110] ±0.5°3"381P/E1--10SEMI Prime, SEMI Flat (one) @ <1,-1,0>, in Empak cassettes of 7 + 7 wafers
1127015$ 216.00n-type Si:P[100] ±1.0°3"3,000 ±100P/P10--12Prime, NO Flats, Individual cst, Packs of 5 & 10 wafers
A09785$ 864.00n-type Si:P[100]3"170 ±1P/P1--10SEMI Prime, NO Flats, Super Flat, TTV<1µm, Empak cst
B09783$ 396.00n-type Si:P[100]3"170 ±1P/P1--10SEMI TEST (Front Side Perfect, Back Side Scratched), NO Flats, Super Flat, TTV<1µm, Empak cst
B17932$ 90.00n-type Si:P[100]3"300P/P1--10SEMI Prime, 2Flats, TTV<1µm, Empak cst
A05649$ 72.00n-type Si:P[100]3"350P/P1--3SEMI Prime, 2Flats, TTV<1µm, Empak cst
D3161$ 90.00n-type Si:P[100]3"350P/P1--3SEMI Prime, 2Flats, Empak cst
1203615$ 1,062.00n-type Si:P[100]3"380SiNOxP/EOxSiN1--10SEMI Prime, 1Flat, Wet Thermal Oxide 5µm ±5% thick over polished & etched sides, LPCVD Low Stress Silicon Nitride 350nm ±5% thick over Oxide on both sides, Empak cassette of 15
E25219$ 46.80n-type Si:P[100]3"381P/P1-20 {1.25-2.50}SEMI Prime, 1Flat, TTV<1µm, Empak cst
N15016$ 24.48n-type Si:P[100]3"381P/P1--5SEMI Prime, 1Flat, TTV<5µm, Bow/Warp<10µm, Empak cst
S592915$ 10.80n-type Si:P[100]3"400P/E1--50SEMI Test, 1Flat, Empak cst
A31211$ 140.40n-type Si:P[100]3"450P/P1--10SEMI Prime, 1Flat, LaserMark, TTV<2µm, Bow<10µm, Empak cst
S58565$ 40.68n-type Si:P[100-4°] ±0.5°3"500P/E1--20SEMI Prime, 2Flats, Empak cst
H31310$ 143.64n-type Si:P[100]3"650P/P1--10SEMI Prime, 1Flat, LaserMark, TTV<2µm, Bow<10µm, Empak cst
A08732$ 176.40n-type Si:P[100]3"5,000P/E1-100SEMI Prime, 1Flat, Individual cst, Pack of 2 wafers
A21891$ 194.40n-type Si:P[100]3"5,000P/E1-100SEMI Prime, 1Flat, Individual cst
B23815$ 123.84n-type Si:P[100]3"5,000P/E1-100SEMI Prime, 1Flat, Individual cst
A231411$ 120.24n-type Si:P[100]3"5,020 ±15P/E1-100SEMI Prime, 1Flat, Individual cst, In Groups of 7 + 4 wafers
S59212$ 179.64n-type Si:P[100]3"7,620 ±100P/E1--10SEMI, TEST (Edge Chips), NO Flats, in individual cassettes (Sold in Packs of 2 wafers)
J7634$ 45.00n-type Si:Sb[100]3"300P/E0.02-0.04SEMI Prime, 2Flats, in hard cassettes of 2 wafers
U15614$ 57.60n-type Si:As[100]3"300P/P0.001-0.005SEMI Prime, 1Flat, Back-side has a non-Prime polish, Empak cst
409616$ 20.88n-type Si:As[100]3"380P/EOx0.001-0.005SEMI Prime, 2Flats, LTO Back-side seal 0.5µm thick, Empak cst
A5421$ 45.00n-type Si:As[100]3"380BROKEN0.001-0.005Many broken pieces from one wafer, Biggest pieces are ~5% of total 3" wafer
572110$ 51.84n-type Si:P[111] ±1.0°3"1,500P/P31-35SEMI Prime, 1Flat, Empak cassettes of 10 + 10 + 9 wafers
12635$ 86.40n-type Si:P[111] ±0.5°3"1,400P/E25-35SEMI Prime, 1Flat, in individual cassettes (sold in groups of 5 wafers)
G27113$ 70.56n-type Si:P[111] ±0.5°3"500P/E>10SEMI Prime, 1Flat, Empak cst
G20613$ 17.64n-type Si:P[111-5° towards[110]] ±0.25°3"1,000P/E>5SEMI Prime, 1Flat, in hard cassettes of 6 & 7 wafers
S55522$ 90.00n-type Si:P[111] ±0.5°3"380P/E1--10SEMI Prime, Empak cst
TS00112$ 17.64n-type Si:P[111-3.0°] ±1°3"381P/E1-20 {3-8}SEMI Prime, 2Flats, TTV<5µm, Bow<8µm, Warp<16µm, Thickness measured 380±15µm, Empak cst
F13613$ 63.00n-type Si:P[111] ±0.5°3"1,000P/P0.5-2.0SEMI Prime, 2Flats, Empak cst
225610$ 32.40n-type Si:Sb[111] ±0.5°3"380P/E0.019-0.026SEMI Prime, 2Flats, in Empak cassettes of 5 wafers
TS02412$ 15.84n-type Si:Sb[111-3.5°] ±0.5°3"381P/E0.008-0.016 {0.0142-0.0155}SEMI Prime, 2Flats, TTV<5µm, Empak cst
TS13113$ 15.84n-type Si:Sb[111-3.5°] ±0.5°3"381P/E0.008-0.016 {0.0118-0.0133}SEMI Prime, 2Flats, TTV<6µm, Empak cst (5×25+19+11+5+3 wafers)
TS0703$ 54.00n-type Si:Sb[111-2.5°] ±0.5°3"381P/E0.005-0.016SEMI Prime, 1Flat, TTV<5µm, Empak cst
TS0564$ 15.48n-type Si:Sb[111-1.5°] ±0.5°3"700P/E0.005-0.018 {0.0154-0.0172}SEMI Prime, 2Flats, Empak cst (14+15 wafers)
TS13310$ 14.04n-type Si:As[111-3°] ±0.5°3"381P/E0.002-0.004 {0.0023-0.0028}SEMI Prime, 2Flats, Empak cst (18+17 wafers)
E38010$ 17.28n-type Si:As[111-4°] ±0.5°3"380P/E0.001-0.005SEMI Prime, 2Flats, Empak cst
TS02316$ 14.04n-type Si:As[111-3°] ±0.5°3"381P/E0.0010-0.0045 {0.0027-0.0037}SEMI Prime, 2Flats, Empak cst
C0004$ 45.00Si3"300 ±50P/PPrime polish, Unlabeled wafers, Very good surface, other specifications unknown, Empak cst
185513$ 28.44p-type Si:B[100]3"380OxP/EOx10--20SEMI Prime, 2Flats, DRY Thermal Oxide (5-7)nm thick, on both sides, hard cst
S577710$ 10.80Si???3"?P/P?SEMI TEST (Unsealed), Empak cst
S57786$ 10.80Si3"P/PSEMI TEST (Unsealed), Empak cst
2" Wafers
Note: Surface - P = Polished, E = Etched, C = AsCut, G = Ground, Ox = Oxide (on that surface); Material - CZ unless noted
ItemQty inPriceMaterialOrient.Diam.ThckSurf.ResistivityComment
Stock$/wafer(µm)Ωcm
558010$ 68.40p-type Si:B[110] ±0.5°2"279P/EFZ >1,000Prime, 2Flats (PF at <111>, SF at <111> CW 70.5° from PF), hard cst
114646$ 123.12p-type Si:B[100]2"235P/PFZ 1-5SEMI Prime, 1Flat, MCC Lifetime>1,000µs, hard cst
D7697$ 50.40p-type Si:B[111] ±0.5°2"500P/PFZ 5,000-6,500SEMI TEST, 1Flat, unsealed hard cassette
L6095$ 68.40p-type Si:B[111] ±0.5°2"275P/EFZ 3,500-5,600SEMI Prime, 1Flat, MCC Lifetime>2,000µs, hard cst
J68813$ 86.40p-type Si:B[111-7° towards[110]] ±0.5°2"279P/PFZ >2,000SEMI Prime, 1Flat, hard cst
F7831$ 180.00p-type Si:B[111] ±0.5°2"331P/EFZ 2,000-5,000SEMI TEST (Scratched), 1Flat, soft cst
G7834$ 86.40p-type Si:B[111] ±0.5°2"331P/EFZ 2,000-5,000SEMI Prime, 1Flat, soft cst
B0273$ 54.00p-type Si:B[111]2"381P/EFZ 2,000-5,000SEMI TEST (scratched, cannot be recleaned), 1Flat, hard cst
283316$ 30.24p-type Si:B[111] ±0.5°2"280 ±15P/EFZ >1,000SEMI Prime, 1Flat, hard cst
A2016$ 74.16p-type Si:B[111]2"300P/PFZ 730-1,050SEMI Prime, 1Flat, hard cst
A08955$ 316.80p-type Si:B[755] ±0.5°2"280P/PFZ 1-10SEMI Prime, 1Flat at <0,-1,1>, MCC Lifetime>1,200µs, hard cst
B0498$ 68.40n-type Si:P[110] ±1°2"525P/EFZ 5,000-10,000SEMI Prime, 2Flats (PF at [111]±0.5°, SF at [111] CW 70.5° from PF), MCC Lifetime>1,000µs, in hard cassettes of 7, 8, 8 wafers
C0496$ 108.00n-type Si:P[110] ±1°2"525P/EFZ 5,000-10,000SEMI Prime, 2Flats (PF at [111]±0.5°, SF at [111] CW 70.5° from PF), MCC Lifetime>1,000µs, hard cst
289413$ 81.00n-type Si:P[110]2"900P/EFZ 130-350SEMI Prime, 1Flat at <1,-1,0>, hard cst
40326$ 108.00n-type Si:P[110] ±0.5°2"900P/EFZ 50-100SEMI Prime, 1Flat at <1,-1,0>±0.5°, hard cst
A084315$ 113.04n-type Si:P[100]2"500P/PFZ >5,000SEMI Prime, 2Flats, MCC Lifetime>1,000µs, hard cst
105326$ 88.56n-type Si:P[100]2"500P/PFZ ~200SEMI Prime, 2Flats, hard cst
1157114$ 64.08n-type Si:P[100]2"300P/PFZ >100SEMI Prime, 2Flats, hard cst
A05471$ 432.00n-type Si:P[111] ±0.5°2"6,350 ±100C/CFZ 5,000-13,000NO Flats, Individual cst
E7808$ 50.40n-type Si:P[111] ±0.5°2"280P/PFZ 2,000-4,000SEMI Prime, 1Flat, TTV<5µm, hard cst
726415$ 68.40n-type Si:Sb[111-2° towards[110]]2"280P/EFZ 0.008-0.015SEMI Prime, 1Flat, hard cst
A16291$ 2,520.00n-type Si:P[011] ±2°2"6,000 ±50P/PFZ NTD 500-550SEMI Prime, 1Flat @ <211>, made from Topsil Ingot, MCC Lifetime>1,000µs, Individual cst
B14972$ 324.00Intrinsic Si:-[100]2"250P/PFZ >20,000SEMI Prime, 1Flat, MCC Lifetime>1,000µs, TTV<5µm, hard cst
122729$ 71.64Intrinsic Si:-[100]2"280P/PFZ >20,000SEMI Prime, 1Flat, MCC Lifetime>1,000µs, hard cst
A14652$ 161.28Intrinsic Si:-[100]2"280P/PFZ >20,000SEMI Prime, 1Flat, MCC Lifetime>1,000µs, hard cst
A04131$ 275.04Intrinsic Si:-[100]2"280P/EFZ >20,000SEMI Prime, 1Flat, MCC Lifetime>1,000µs, hard cst
A14983$ 176.40Intrinsic Si:-[100]2"500 ±10P/PFZ >20,000SEMI Prime, 1Flat, MCC Lifetime>1,000µs, in hard cst
A19217$ 141.84Intrinsic Si:-[100]2"500P/PFZ >20,000SEMI Prime, 1Flat, MCC Lifetime>1,000µs, hard cst
112419$ 105.84Intrinsic Si:-[100]2"500P/EFZ >20,000SEMI Prime, 1Flat, MCC Lifetime>1,000µs, hard cst
F31913$ 89.64Intrinsic Si:-[100]2"500 ±10P/EFZ >20,000SEMI Prime, 1Flat, MCC Lifetime>1,000µs, hard cst
B02411$ 324.00Intrinsic Si:-[100]2"10,100C/CFZ >20,0001Flat, MCC Lifetime>1,000µs, unsealed individual hard csts
121295$ 126.00Intrinsic Si:-[100]2"100 ±10P/PFZ >10,000 {22,000-26,000}SEMI Prime, 1Flat, TTV<5µm, hard cst, Group of 5 wafers
A212910$ 126.00Intrinsic Si:-[100]2"100 ±10P/EFZ >10,000 {22,000-26,000}SEMI Prime, 1Flat, TTV<5µm, hard cst, Packs of 10+10+6 wafers
C21223$ 125.64Intrinsic Si:-[100]2"280P/EFZ 10,000-20,000SEMI Prime, 1Flat, TTV<2µm, hard cst
A15565$ 195.84Intrinsic Si:-[100]2"331 ±1P/PFZ >10,000Superflat central 1"Ø, SEMI, 1Flat, MCC Lifetime>1,000µs, TTV<1µm, hard cst
A15665$ 266.40Intrinsic Si:-[100]2"341 ±1P/PFZ >10,000SEMI Prime, 1Flat, MCC Lifetime>1,000µs, hard cst
A02694$ 97.56Intrinsic Si:-[100]2"350P/PFZ >10,000SEMI Prime, 1Flat, MCC Lifetime>1,000µs, hard cst
A177315$ 321.12Intrinsic Si:-[221] ±1°2"500P/PFZ >20,000SEMI Prime, 1Flat at <1,-1,0>, MCC Lifetime>1,000µs, hard cst
A075012$ 77.04Intrinsic Si:-[111] ±0.5°2"280P/PFZ >20,000SEMI Prime, 1Flat, MCC Lifetime>1,000µs, hard cst
F2227$ 125.64Intrinsic Si:-[111] ±0.5°2"330P/PFZ >20,000SEMI Prime, 1Flat, MCC Lifetime>1,000µs, hard cst
E3976$ 86.40Intrinsic Si:-[111] ±0.2°2"300 ±15P/PFZ >10,000SEMI Prime, 1Flat, 2 extra scratched wafers at no extra charge, hard cst
G6139$ 141.84Intrinsic Si:-[111] ±0.5°2"500P/EFZ >10,000SEMI Prime, 1Flat, hard cst
A22376$ 631.44Intrinsic Si:-[643] ±1°2"500P/PFZ >20,000SEMI Prime, 1Flat 16±2mm at <1,-1,0>, with Back-Side LaserMark, MCC Lifetime>1,000µs, TTV<5µm, hard cst
A20498$ 129.96p-type Si:B[110] ±0.1°2"500P/P1--10Prime, 1Flat, TTV<5µm, hard cst
J78318$ 18.00p-type Si:B[110] ±0.5°2"500P/E1--35SEMI Prime, 1Flat at <1,-1,0>±1°, hard cst
A04429$ 104.04p-type Si:B[110] ±0.5°2"200P/P0.009-0.011SEMI Prime, 1Flat at <111>±1°, hard cst
C1183$ 36.00p-type Si:B[100]2"300P/E5--10SEMI Prime, 1Flat, hard cst
A03514$ 143.64p-type Si:B[100]2"762 ±12P/P5--35SEMI Prime, NO Flats, TTV<1µm, Bow<2.5µm, Warp<4µm, hard cst
A13535$ 648.00p-type Si:B[100]25.6mm×25.6mm350P/P2--10Prime, TTV<5µm, 25.6×25.6mm Silicon Frames
124275$ 141.84p-type Si:B[100]2"100 ±10P/P1--10SEMI Prime, 1Flat, TTV<5µm, Individual wafer cst
121445$ 225.00p-type Si:B[100]2"100 ±15P/E1-100SEMI Prime, 1Flat, hard cst, Packs of 5 wafers
F7085$ 105.48p-type Si:B[100]40mm250P/E1-100SEMI Prime, 1Flat, Individual cst, Pack of 5 wafers
A002113$ 36.00p-type Si:B[100]2"275 ±5P/P1-100SEMI Prime, 2Flats, TTV<5µm, Bow/Warp<10µm, Faint impression from polishing pad on back-side (removable upon request), hard cst
B07207$ 176.40p-type Si:B[100]2"775 ±10P/P1--35SEMI Prime, 1Flat, TTV<1.5µm, Bow<8µm, LaserMark & Thickness, TTV, Bow data recorded for each wafer, hard cst
N0846$ 277.20p-type Si:B[100]2"775 ±10P/P1--35SEMI Prime, 1Flat, TTV<5µm, LaserMark, Thickness, TTV, Bow data recorded for each wafer, hard cst
U2061$ 45.00p-type Si:B[100]2"3,150 ±50C/C>0.51Flat, Individual cst, Can be sold individually
1126116$ 19.44p-type Si:B[100]2"279P/P0.08-0.12SEMI Prime, 1Flat, hard cst
H9953$ 39.60p-type Si:B[100]2"300P/E0.016-0.017SEMI Prime, NO Flats, hard cst
A194317$ 87.84p-type Si:B[100]2"280P/P0.01-0.02SEMI Prime, 2Flats, TTV<1µm, hard cst
A11666$ 122.40p-type Si:B[100]2"280NP/PN0.001-1.000SEMI Prime, 2Flats, Both-sides-polished, LPCVD Si3N4 200±10nm on both sides, hard cst
B03945$ 585.00p-type Si:B[100]44×44mm500P/P0.001-0.005Silicon Frames: 44mm square with 40mm square removed from center (drawing available on request)
A037310$ 540.00p-type Si:B[511] ±0.5°48.251,000P/E>10Prime, NO Flats, hard cst
B0395$ 36.00p-type Si:B[111] ±0.5°2"500 ±15P/E1--35SEMI Prime, 1Flat, hard cst
115709$ 47.34p-type Si:B[111] ±0.5°2"600P/E0.01-0.05SEMI Prime, 1Flat, hard cst
603114$ 35.64n-type Si:P[110]2"280P/E19-33SEMI Prime, 1 Flat at <1,-1,0>, hard cst
P7633$ 86.40n-type Si:Sb[110] ±1.0°2"375P/E0.005-0.020SEMI Prime, 1Flat at <1,-1,0>, hard cst
B23051$ 122.40n-type Si:P[100]2"5,000P/E10--35SEMI TEST (scratched), 2Flats, Individual cst
114256$ 536.40n-type Si:P[100]2"190 ±10P/E1--10SEMI Prime, 1Flat, TTV<4µm, hard cst
G62915$ 10.80n-type Si:P[100]2"350P/P1--50SEMI TEST (Scratched, unsealed cst - can be re-polished), NO Flats, hard cst
A19925$ 726.48n-type Si:P[100]2"6,000P/E1-100Prime, NO Flats, Individual cst, Pack of 5 wafers
A24686$ 156.24n-type Si:P[100]2"4,950P/P0.05-0.50SEMI Prime, 2Flats, Individual cst, Group of 6 wafers
A22682$ 105.84n-type Si:P[100]2"5,000P/P0.05-0.50Front side prime, back-side scratched, 2Flats, single wafer cassettes, Group of 2 wafers
124423$ 216.00n-type Si:P[100]2"5,000P/E
A24762$ 176.40n-type Si:P[111] ±0.5°2"4,950 ±50P/P>20Prime, NO Flats, Individual cst
C21963$ 93.60n-type Si:P[111] ±0.5°2"5,000 ±50P/P>20With Edge-Chips, NO Flats, Individual cst, Group of 3 wafers
1244816$ 176.40n-type Si:P[111] ±0.5°2"5,000 ±50P/E>20Prime, NO Flats, Individual cst
B194412$ 92.88n-type Si:P[111] ±0.5°2"10,000 ±10E/E>20 {35-75}SEMI, NO Flats, Packed in a jar
29953$ 84.24n-type Si:P[111-3°] ±0.5°2"600P/E~10SEMI Prime, 1Flat, TTV<3µm, Bow/Warp<3µm, hard cst
S58558$ 41.04n-type Si:P[111] ±0.5°2"500P/P2.8-10.0SEMI Prime, 2Flats, hard cst
F3844$ 68.40n-type Si:P[111]2"275P/P2.5-3.5SEMI Prime, 2Flats, SF 180° from PF (not 45° CW from PF), hard cst
N7638$ 36.00n-type Si:P[111]2"500P/E2.2-3.8SEMI Prime, 2Flats, hard cst
G1361$ 210.24n-type Si:P[111]2"275P/P1.48-1.70SEMI Prime, 1Flat, hard cst
G0314$ 36.00n-type Si:P[111]2"500P/E1--10SEMI Prime, 2Flats, hard cst
48781$ 158.76n-type Si:P[111] ±0.5°2"6,000P/E1--10SEMI Prime, 1Flat, Individual cst
Q9628$ 43.20n-type Si:Sb[111-3.5°] ±0.5°2"300P/E0.05-0.09SEMI Prime, 2Flats, hard cst
1106415$ 23.04n-type Si:As[111] ±0.5°2"280P/E0.001-0.005SEMI Prime, 1Flat, hard cst
109905$ 123.84n-type Si:As[111] ±0.5°2"5,000 ±50P/E0.001-0.005SEMI TEST, NO Flats, coin roll
1" Wafers
Note: Surface - P = Polished, E = Etched, C = AsCut, G = Ground, Ox = Oxide (on that surface); Material - CZ unless noted
Item# Qty Qty in Price Material Orient. Diam. Thck Source Resistivity Comment
Stock $/wafer (µm) Ωcm
D9758$ 46.80n-type Si:P[100]1"475 ±10E/EFZ >500 {1,900-2,400}NO Flats, Soft cst
54278$ 43.20Intrinsic Si:-[111] ±0.5°1"500P/PFZ >15,000SEMI Prime, 1Flat, hard cst
82151$ 356.40p-type Si:B[100-9° towards[001]]32 mm2,000 ±50P/E>10Zero X-Ray Diffraction plate, with central sample pocket 5mmØ×200µm, NO Flats, Individual cst
1051110$ 162.00p-type Si:B[100]1"100 ±15P/P1--10Prime, NO Flats, Individual cassettes, In Packs of 10, 10, 10, 10, 4 wafers
1156310$ 21.60p-type Si:B[100]24mm300P/E1-100Prime, NO Flats, hard cst
1005513$ 28.80p-type Si:B[100]1"525 ±10P/E1--35Prime, NO Flats, TTV<5µm, hard cst
102208$ 28.80p-type Si:B[100]1"525 ±10P/E1--35Prime, NO Flats, TTV<5µm, hard cst
A03853$ 54.00p-type Si:B[100]1"525 ±10P/E1--35Prime, NO Flats, TTV<5µm, hard cst
68799$ 30.24p-type Si:B[100]1"275P/E0.0022-0.0025Prime, NO Flats, hard cst
1217513$ 21.24p-type Si:B[100]1"525P/E0.001-0.005Prime, NO Flats, TTV<5µm, hard cst
B229910$ 21.24p-type Si:B[100]1"525P/E0.001-0.005Prime, NO Flats, TTV<5µm, hard cst
61791$ 86.40n-type Si:P[100]1"1,500P/E1--20Prime, NO Flats, Individual cst
A202214$ 48.60n-type Si:P[100]1"1,500P/E1-20 {1.5-8.4}Prime, NO Flats, hard cst
65958$ 39.60n-type Si:P[100]1"525P/E0.05-0.15SEMI Prime, 1Flat, Soft cst
110385$ 90.00n-type Si:As[100]1"300P/P0.001-0.005Prime, NO Flats, hard cst
<1" Wafers
Note: Surface – P = Polished, E = Etched, C = AsCut, G = Ground, Ox = Oxide (on that surface); Material – CZ unless noted
Item Qty $/Wafer Material Orient. Diam. Thck Surf. Resistivity Comment
(µm) Ω·cm
6446 1 $270.00 Intrinsic Si [100] 0.5" 12,700 ±50 C/C FZ >10,000 NO Flats, set of 4 rods sealed in polyethylene foil
4427 8 $324.00 Intrinsic Si [111] ±2° 0.39" 27,870 ±100 C/C FZ >10,000 Single crystal Si rod, 9.9mm Ø × 27.9mm, NO Flats
12050 6 $203.76 n-type Si:P [100] 10.0 ±0.2 mm 1,500 ±50 P/G Prime, NO Flats, polished side Ra <3Å rms, hard cassette
A2050 6 $230.40 n-type Si:P [100] 20.0 × 15.0 mm 5,000 ±200 P/E Silicon cubes, one-side SEMI Prime polished, Ra <3Å rms